Kulicke & Soffa and ROHM Semiconductor Develop New CuFirst™ Hybrid Bonding Process
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Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) has partnered with ROHM Co., Ltd to develop a new CuFirst™ hybrid bonding process. This collaboration leverages Kulicke & Soffa's Fluxless Thermo-Compression (FTC) process and ROHM's technology innovations to enhance chip-to-wafer hybrid bonding.
November 13, 2024 | 9:15 pm
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Kulicke & Soffa Industries, Inc. has announced a partnership with ROHM to develop the CuFirst™ hybrid bonding process, which could enhance their product offerings in the semiconductor industry.
The partnership with ROHM to develop the CuFirst™ hybrid bonding process is likely to enhance Kulicke & Soffa's product offerings, potentially leading to increased demand and positive investor sentiment.
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