Kulicke & Soffa and ROHM Semiconductor Develop New CuFirst™ Hybrid Bonding Process
Portfolio Pulse from
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) has partnered with ROHM Co., Ltd to develop a new CuFirst™ hybrid bonding process. This collaboration leverages Kulicke & Soffa's Fluxless Thermo-Compression (FTC) process and ROHM's technology innovations to enhance chip-to-wafer hybrid bonding.
November 13, 2024 | 9:15 pm
News sentiment analysis
Sort by:
Descending
POSITIVE IMPACT
Kulicke & Soffa Industries, Inc. has announced a partnership with ROHM to develop the CuFirst™ hybrid bonding process, which could enhance their product offerings in the semiconductor industry.
The partnership with ROHM to develop the CuFirst™ hybrid bonding process is likely to enhance Kulicke & Soffa's product offerings, potentially leading to increased demand and positive investor sentiment.
CONFIDENCE 90
IMPORTANCE 80
RELEVANCE 90