GlobalFoundries Announces New York Advanced Packaging and Photonics Center
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GlobalFoundries has announced the establishment of a new Advanced Packaging and Photonics Center in New York. This center will provide advanced packaging and testing capabilities for U.S.-made chips used in AI, automotive, aerospace, and defense sectors.
January 17, 2025 | 10:15 am
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GlobalFoundries is launching a new Advanced Packaging and Photonics Center in New York, enhancing its capabilities in the semiconductor industry, particularly for AI, automotive, aerospace, and defense applications.
The establishment of the new center positions GlobalFoundries to better serve high-demand sectors like AI and defense, potentially increasing its market share and revenue. This strategic move is likely to positively impact its stock price in the short term.
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