Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4
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Ceva, Inc. has launched the Ceva-Waves Links200, a new multi-protocol wireless connectivity platform IP. This platform supports next-generation Bluetooth High Data Throughput and IEEE 802.15.4 for Zigbee, Thread, and Matter, using TSMC 12nm technology.
January 02, 2025 | 12:15 pm
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Ceva, Inc. has introduced the Ceva-Waves Links200, a cutting-edge multi-protocol wireless connectivity platform. This innovation supports advanced Bluetooth HDT and IEEE 802.15.4, potentially enhancing Ceva's market position in smart edge device connectivity.
The launch of the Ceva-Waves Links200 positions Ceva as a leader in the wireless connectivity market, potentially increasing demand for its IP solutions. The integration of next-gen Bluetooth HDT and IEEE 802.15.4 could attract more clients in the smart edge device sector, positively impacting CEVA's stock price.
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