'Amkor And TSMC Team Up For Advanced Packaging In The U.S. — CoWoS And InFo To make AI And HPC CPUs' - Tom's Hardware
Portfolio Pulse from Benzinga Newsdesk
Amkor and TSMC have announced a collaboration to bring advanced chip packaging technologies, CoWoS and InFo, to the U.S. This partnership will enhance semiconductor production efficiency and reduce reliance on Taiwan. Amkor's new facility in Arizona will serve TSMC's customers, including Apple.
October 04, 2024 | 4:02 pm
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Amkor's collaboration with TSMC to bring advanced packaging technologies to the U.S. positions it as a key player in the semiconductor supply chain, potentially boosting its business with major clients like Apple.
Amkor's new facility in Arizona will serve TSMC's customers, including Apple, with advanced packaging technologies. This positions Amkor as a crucial player in the U.S. semiconductor supply chain, likely increasing its business and market presence.
CONFIDENCE 95
IMPORTANCE 90
RELEVANCE 100
POSITIVE IMPACT
TSMC's partnership with Amkor to introduce CoWoS and InFo technologies in the U.S. enhances its manufacturing footprint and supports its clients with advanced packaging solutions, potentially increasing its influence in the U.S. market.
By collaborating with Amkor, TSMC is expanding its advanced packaging capabilities in the U.S., which could strengthen its market position and client relationships, particularly with major tech companies.
CONFIDENCE 90
IMPORTANCE 85
RELEVANCE 90