Onto Innovation Announced The Opening Of The Company's Packaging Applications Center Of Excellence in US, Dedicated To Panel-level Packaging Innovations Enabling 2.5D And 3D Chiplet Architectures And AI Packages
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Onto Innovation has opened a new Packaging Applications Center of Excellence in the US, focusing on panel-level packaging innovations for 2.5D and 3D chiplet architectures and AI packages.
September 04, 2024 | 11:19 am
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Onto Innovation's new center focuses on advanced packaging technologies, potentially enhancing its market position in chiplet and AI package innovations.
The opening of the new center signifies Onto Innovation's commitment to advancing packaging technologies, which could lead to increased demand and market share in the semiconductor industry.
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