Veeco And IBM Announce Agreement To Explore Wet Processing System For Advanced Packaging Applications
Portfolio Pulse from Benzinga Newsdesk
Veeco Instruments Inc. (NASDAQ:VECO) and IBM have entered into a joint development agreement to explore advanced packaging applications using Veeco's WaferStorm® Wet Processing System. The system will be installed at the Albany NanoTech Complex, where IBM and other partners are conducting R&D in advanced packaging and chiplet technologies.
August 14, 2024 | 1:05 pm
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IBM has selected Veeco's WaferStorm® Wet Processing System for advanced packaging applications and entered into a joint development agreement with Veeco. This collaboration could enhance IBM's R&D capabilities in advanced packaging and chiplet technologies.
The partnership with Veeco allows IBM to leverage advanced wet processing technologies, potentially accelerating its R&D in advanced packaging and chiplet technologies, which could lead to future innovations and market advantages.
CONFIDENCE 85
IMPORTANCE 70
RELEVANCE 80
POSITIVE IMPACT
Veeco Instruments Inc. (NASDAQ:VECO) has entered into a joint development agreement with IBM to explore advanced packaging applications using its WaferStorm® Wet Processing System. This collaboration could enhance Veeco's market position in the semiconductor industry.
The joint development agreement with IBM positions Veeco as a key player in advanced packaging technologies, potentially increasing demand for its WaferStorm® system and boosting its market presence.
CONFIDENCE 90
IMPORTANCE 80
RELEVANCE 100