Amkor Technology Says It Inked Preliminary Memorandum Of Terms With US Department Of Commerce For Arizona Advanced Packaging And Test Facility
Portfolio Pulse from Benzinga Newsdesk
Amkor Technology has signed a preliminary memorandum of terms with the US Department of Commerce to establish an advanced packaging and test facility in Arizona.
July 26, 2024 | 9:08 am
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Amkor Technology has signed a preliminary memorandum of terms with the US Department of Commerce to establish an advanced packaging and test facility in Arizona. This move could enhance Amkor's capabilities and market position in the semiconductor industry.
The agreement with the US Department of Commerce is a significant step for Amkor Technology, potentially enhancing its capabilities and market position in the semiconductor industry. This could lead to increased investor confidence and a positive short-term impact on the stock price.
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