Cadence And Samsung Foundry Accelerate Design For AI And 3D-IC Semiconductors
Portfolio Pulse from Benzinga Newsdesk
Cadence and Samsung Foundry are collaborating to accelerate the design of AI and 3D-IC semiconductors. Cadence's digital and analog tools are optimized for advanced node SF2 GAA, enhancing quality and speeding up circuit process node migration. Their 3D-IC technology supports Samsung Foundry's multi-die integration, facilitating the design and assembly of stacked chiplets. Cadence's IP portfolio and tools aim to help customers achieve first-pass silicon success and faster time to market.
June 12, 2024 | 2:46 pm
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Cadence's collaboration with Samsung Foundry to enhance AI and 3D-IC semiconductor design is likely to positively impact its stock. The partnership leverages Cadence's advanced tools and broad IP portfolio, potentially accelerating time to market for customers.
The partnership with Samsung Foundry positions Cadence as a key player in the advanced semiconductor design space. Their optimized tools and broad IP portfolio are likely to attract more customers, enhancing revenue and market position.
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