Reported Earlier, Rapidus And IBM Inks Joint Development Partnership To Include Chiplet Packaging Technology For 2nm-Generation Semiconductors
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Rapidus and IBM have entered into a joint development partnership to work on chiplet packaging technology for 2nm-generation semiconductors. This collaboration is part of a larger international project led by Japan's NEDO and builds on an existing agreement between IBM and Rapidus for 2nm node technology development. Engineers from both companies will collaborate at IBM's North American facilities for R&D and manufacturing.
June 04, 2024 | 6:03 am
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IBM has entered into a joint development partnership with Rapidus to work on chiplet packaging technology for 2nm-generation semiconductors. This collaboration is part of a larger international project led by Japan's NEDO and builds on an existing agreement for 2nm node technology development. Engineers from both companies will collaborate at IBM's North American facilities for R&D and manufacturing.
The partnership with Rapidus to develop 2nm-generation semiconductor chiplet packaging technology is likely to enhance IBM's capabilities in high-performance computing systems. This collaboration could lead to advancements in semiconductor technology, potentially boosting IBM's revenue and market position in the semiconductor industry.
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