US Commerce Department Grants $75M To Absolics For Semiconductor Facility In Georgia
Portfolio Pulse from Shivani Kumaresan
The U.S. Commerce Department has granted $75 million to Absolics Inc. for a new semiconductor facility in Georgia, under the CHIPS and Science Act. The facility will focus on advanced substrate technology for semiconductor packaging, creating 1,000 construction jobs and 200 manufacturing and research positions. Absolics, an affiliate of SKC Co., has Applied Materials Inc. (NASDAQ:AMAT) as an investor. The initiative aims to boost U.S. leadership in semiconductor technology.
May 23, 2024 | 1:14 pm
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Applied Materials Inc. (NASDAQ:AMAT) is an investor in Absolics' new semiconductor facility in Georgia, which received a $75 million grant from the U.S. Commerce Department. This investment could enhance AMAT's position in the semiconductor supply chain.
As an investor in Absolics' new facility, Applied Materials stands to benefit from the advancements in semiconductor packaging technology and increased production capacity, potentially boosting its market position and revenues.
CONFIDENCE 90
IMPORTANCE 70
RELEVANCE 80
POSITIVE IMPACT
Amkor Technology Inc (NASDAQ:AMKR) plans to invest $2 billion in a new packaging and testing facility in Arizona. This investment aligns with the U.S. Commerce Department's emphasis on advanced packaging.
Amkor's significant investment in a new facility aligns with the U.S. Commerce Department's focus on advanced packaging, potentially enhancing its capabilities and market position in the semiconductor industry.
CONFIDENCE 85
IMPORTANCE 70
RELEVANCE 70
POSITIVE IMPACT
Intel Corp (NASDAQ:INTC) is mentioned as a potential recipient of significant awards from the U.S. Commerce Department's $3 billion plan to support advanced packaging. This could enhance Intel's capabilities in semiconductor packaging.
Intel's potential receipt of significant awards from the U.S. Commerce Department's plan could bolster its advanced packaging capabilities, enhancing its competitive edge in the semiconductor market.
CONFIDENCE 80
IMPORTANCE 60
RELEVANCE 50
POSITIVE IMPACT
Micron Technology Inc (NASDAQ:MU) is mentioned as a potential recipient of significant awards from the U.S. Commerce Department's $3 billion plan to support advanced packaging. This could improve Micron's semiconductor packaging capabilities.
Micron's potential receipt of significant awards from the U.S. Commerce Department's plan could enhance its advanced packaging capabilities, boosting its competitive position in the semiconductor market.
CONFIDENCE 80
IMPORTANCE 60
RELEVANCE 50
POSITIVE IMPACT
Taiwan Semiconductor Mfg Co Ltd (NYSE:TSM) is mentioned as a potential recipient of significant awards from the U.S. Commerce Department's $3 billion plan to support advanced packaging. This could strengthen TSM's market position.
TSMC's potential receipt of significant awards from the U.S. Commerce Department's plan could enhance its advanced packaging capabilities, further solidifying its leadership in the semiconductor industry.
CONFIDENCE 80
IMPORTANCE 60
RELEVANCE 50