"Intel Has Placed Orders With Multiple Equipment And Material Suppliers For Its Next-Generation Advanced Packaging Based On Glass Substrate Technology, Which Is Expected To Be In Volume Production By 2030, According To Industry Sources" - DigiTimes Alerts
Portfolio Pulse from Benzinga Newsdesk
Intel has placed orders with multiple equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, expected to be in volume production by 2030.
May 16, 2024 | 1:34 pm
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Intel has placed orders for advanced packaging technology based on glass substrates, with volume production expected by 2030. This move indicates Intel's commitment to innovation and could positively impact its future revenue streams.
Intel's investment in next-generation packaging technology signals a strong commitment to innovation, which is likely to enhance its competitive edge and future revenue streams. This news is highly relevant and important for investors as it reflects Intel's strategic direction.
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