STMicroelectronics Expands Into 3D Depth Sensing With Latest Time-Of-Flight Sensors
Portfolio Pulse from Benzinga Newsdesk
STMicroelectronics (NYSE:STM) has expanded its portfolio in 3D depth sensing with the launch of new Time-of-Flight (ToF) sensors, including a market-first all-in-one direct ToF 3D LiDAR module with 2.3k resolution and the world's smallest 500k-pixel indirect ToF sensor. The company has achieved a milestone with two billion FlightSense devices sold and continues to innovate with these new sensors targeting applications in camera assist, virtual reality, robotics, and smart buildings. The VL53L9 LiDAR device offers unique features for enhanced camera and VR experiences, while the VD55H1 sensor, now in volume production, has secured a design win with Lanxin Technology for mobile-robot vision systems.
February 22, 2024 | 2:12 pm
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STMicroelectronics has introduced innovative ToF sensors, including a direct 3D LiDAR module and the smallest iToF sensor, marking significant advancements in 3D depth sensing technology.
The introduction of these new ToF sensors by STMicroelectronics represents a significant advancement in 3D depth sensing technology, which is likely to enhance STM's market position and potentially increase its stock price in the short term. The announcement of reaching two billion FlightSense devices sold underscores the company's leading role in the market, further supporting the positive outlook. The specific mention of a design win with Lanxin Technology for the VD55H1 sensor highlights STM's ongoing success in securing partnerships, which can drive revenue growth and positively impact investor sentiment.
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