UMC Targets Growth in Edge AI With W2W 3D IC Project
Portfolio Pulse from Benzinga Newsdesk
United Microelectronics Corporation (UMC) has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence. The project aims to accelerate production of 3D products by integrating memory and processor with silicon stacking technology. The platform is expected to be ready in 2024 and targets edge AI applications.
October 31, 2023 | 7:21 am
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UMC's initiation of the W2W 3D IC project could potentially boost its position in the semiconductor industry by accelerating the production of 3D products. The project's focus on edge AI applications could also open new market opportunities.
The news directly pertains to UMC as it is the company initiating the project. The project's focus on edge AI applications, a growing market, could potentially boost UMC's revenues and market position. However, the platform's readiness in 2024 introduces a time factor that could affect the immediacy of the impact.
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