Synopsys And TSMC Streamline Multi-Die System Complexity With Unified Exploration-To-Signoff Platform And Proven UCIe IP On TSMC N3E Process
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Synopsys, Inc. (NASDAQ:SNPS) is extending its collaboration with TSMC (NYSE:TSM) to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC's 3DFabric™ technologies. The Synopsys Multi-Die System solution includes 3DIC Compiler, a unified exploration-to-signoff platform that delivers the highest levels of design efficiency for capacity and performance. Synopsys has achieved first-pass silicon success of its Universal Chiplet Interconnect Express (UCIe) IP on TSMC's leading N3E process for seamless die-to-die connectivity.
September 27, 2023 | 1:27 pm
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POSITIVE IMPACT
Synopsys is extending its collaboration with TSMC to advance multi-die system designs, which includes the 3DIC Compiler and the UCIe IP that achieved first-pass silicon success on TSMC's N3E process.
The extended collaboration with TSMC and the successful first-pass silicon success of the UCIe IP on TSMC's N3E process are positive developments for Synopsys. This could potentially lead to increased demand for their products and services, which could positively impact their stock price in the short term.
CONFIDENCE 90
IMPORTANCE 80
RELEVANCE 100
POSITIVE IMPACT
TSMC is extending its collaboration with Synopsys to advance multi-die system designs, which includes the 3DIC Compiler and the UCIe IP that achieved first-pass silicon success on TSMC's N3E process.
The extended collaboration with Synopsys and the successful first-pass silicon success of the UCIe IP on TSMC's N3E process are positive developments for TSMC. This could potentially lead to increased demand for their products and services, which could positively impact their stock price in the short term.
CONFIDENCE 90
IMPORTANCE 80
RELEVANCE 100