Intel Unveils Industry-Leading Glass Substrates To Meet Demand For More Powerful Compute
Portfolio Pulse from Benzinga Newsdesk
Intel has announced the development of industry-leading glass substrates for next-generation advanced packaging, which will enable the continued scaling of transistors in a package and advance Moore's Law. The glass substrates offer properties such as ultra-low flatness and better thermal and mechanical stability, resulting in higher interconnect density in a substrate. This will allow chip architects to create high-density, high-performance chip packages for data-intensive workloads such as AI. Intel plans to deliver complete glass substrate solutions to the market in the second half of this decade.

September 18, 2023 | 1:03 pm
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Intel's announcement of the development of glass substrates for advanced packaging is a significant technological breakthrough. This could potentially lead to the creation of high-density, high-performance chip packages, which could boost Intel's market position and competitiveness.
The development of glass substrates for advanced packaging is a significant technological advancement for Intel. This could potentially lead to the creation of high-density, high-performance chip packages, which are in high demand for data-intensive workloads such as AI. This could boost Intel's market position and competitiveness, potentially leading to increased demand for its products and a positive impact on its stock price.
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