Intel has announced the development of industry-leading glass substrates for next-generation advanced packaging, which will enable the continued scaling of transistors in a package and advance Moore's Law. The glass substrates offer properties such as ultra-low flatness and better thermal and mechanical stability, resulting in higher interconnect density in a substrate. This will allow chip architects to create high-density, high-performance chip packages for data-intensive workloads such as AI. Intel plans to deliver complete glass substrate solutions to the market in the second half of this decade.