'AMD To Adopt TSMC 3D Soic Tech In Gaming Notebook Processors, Say Sources' - DigiTimes Alert
Portfolio Pulse from Benzinga Newsdesk
AMD is planning to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors. This follows AMD's implementation of the same technology in its high-end AI accelerators and desktop processors.
August 04, 2023 | 11:14 am
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POSITIVE IMPACT
AMD's adoption of TSMC's 3D SoIC technology in its gaming notebook processors could potentially enhance the performance of these products, possibly leading to increased sales.
AMD's decision to incorporate TSMC's 3D SoIC technology into its gaming notebook processors could potentially enhance the performance of these products. This could make them more attractive to consumers, possibly leading to increased sales and a positive impact on AMD's stock price.
CONFIDENCE 80
IMPORTANCE 75
RELEVANCE 100
POSITIVE IMPACT
AMD's adoption of TSMC's 3D SoIC technology could potentially lead to increased business for TSMC.
AMD's decision to incorporate TSMC's 3D SoIC technology into its gaming notebook processors could potentially lead to increased business for TSMC. This could have a positive impact on TSMC's stock price.
CONFIDENCE 80
IMPORTANCE 60
RELEVANCE 75