TSMC Holds Extensive Patents in Advanced Chip Packaging, Outpacing Samsung and Intel: Report
Portfolio Pulse from Anusuya Lahiri
Taiwan Semiconductor Manufacturing Company Ltd (TSMC) leads in advanced chip packaging patents, followed by Samsung Electronics and Intel Corp. TSMC holds 2,946 patents, Samsung has 2,404, and Intel has 1,434. Advanced packaging is crucial for chip contract manufacturers. TSMC, Samsung, and Intel have been investing in this technology since around 2015. Advanced Micro Devices (AMD) has gained a competitive edge with its chiplet technology.
August 04, 2023 | 11:18 am
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POSITIVE IMPACT
AMD's chiplet technology has provided a competitive edge for its server chips over Intel's.
AMD's competitive edge with its chiplet technology could potentially lead to increased demand for its server chips and positive impact on its stock.
CONFIDENCE 90
IMPORTANCE 80
RELEVANCE 70
POSITIVE IMPACT
TSMC leads in advanced chip packaging patents, which is crucial for chip contract manufacturers.
TSMC's leading position in advanced chip packaging patents indicates its strong technological capabilities, which could potentially lead to increased demand for its services and positive impact on its stock.
CONFIDENCE 90
IMPORTANCE 80
RELEVANCE 100
NEUTRAL IMPACT
Samsung ranks second in advanced chip packaging patents.
Samsung's strong position in advanced chip packaging patents indicates its technological capabilities, but as it's not the leader, the impact on its stock is likely to be neutral.
CONFIDENCE 90
IMPORTANCE 70
RELEVANCE 80
NEGATIVE IMPACT
Intel ranks third in advanced chip packaging patents.
Intel's lower ranking in advanced chip packaging patents compared to its competitors could potentially lead to decreased demand for its services and negative impact on its stock.
CONFIDENCE 90
IMPORTANCE 70
RELEVANCE 80