DuPont Introduces SOLDERON BP TS 7000 Chemistry As Newest Addition To The Tin-Silver Plating Bath Family
Portfolio Pulse from Happy Mohamed
DuPont Electronics & Industrial introduced SOLDERON BP TS 7000, a high-performance tin-silver plating chemistry for microbump solder-plating applications. The new lead-free formulation offers improved plating rates, performance, bath stability, and process flexibility for advanced packaging applications.
May 30, 2023 | 1:16 pm
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DuPont's new SOLDERON BP TS 7000 tin-silver plating chemistry offers improved performance and efficiency for advanced packaging applications, potentially increasing demand for the company's products.
The introduction of SOLDERON BP TS 7000 positions DuPont as a leader in tin-silver plating chemistry for advanced packaging applications. The product's improved performance, efficiency, and versatility may attract more customers and increase demand for DuPont's offerings, positively impacting the company's stock price in the short term.
CONFIDENCE 90
IMPORTANCE 75
RELEVANCE 100